The **ATS-16F-50-C3-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is part of their "maxiFLOW™" series, designed for cooling high-power semiconductors. --- ## Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Product Series** | maxiFLOW™ | | **Material** | Aluminum (Black Anodized) | | **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 14.73mm | | **Thermal Resistance** | 1.90 °C/W (@ 200 LFM) | | **Attachment Method** | pushPIN™ (Brass Pins) | | **Spring Type** | Compression Spring | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## Breakdown of Part Numbering Understanding the code `ATS-16F-50-C3-R0` helps identify its specific configuration: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **16**: Series identifier. * **F**: Fin design type (specifically tailored for high airflow). * **50**: Specific size/geometry identifier. * **C3**: Thermal Interface Material (TIM) and Spring type code. * **R0**: Revision/RoHS compliance status. --- ## Key Features & Construction ### 1. maxiFLOW™ Fin Geometry The heat sink features a unique **flared fin** design. Unlike standard straight-fin sinks, the flared design increases the surface area and creates better air turbulence, which significantly improves thermal performance in forced-convection environments. ### 2. pushPIN™ Attachment This part utilizes the **pushPIN™** system for mounting. This is an engineered mounting solution that includes: * A plastic or brass pin that goes through the PCB. * A compression spring that provides a specific, consistent pressure (Force) on the component to ensure maximum heat transfer. ### 3. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This eliminates the need for manual application of thermal paste and ensures a uniform, void-free layer between the heat sink and the chip. --- ## Common Applications This heat sink is typically used on high-heat generating integrated circuits (ICs) such as: * **FPGAs** (Field Programmable Gate Arrays) * **ASICs** (Application Specific Integrated Circuits) * **Processors/CPUs** in embedded systems * **Network Switches and Routers**