The part number **ATS-16F-52-C3-R0** refers to a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** series, specifically designed for cooling electronic components like processors, FPGAs, and ASICs. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Thermal Resistance** | 3.50°C/W @ 200 LFM | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | pushPIN™ (Brass Pins) | | **Spring Type** | Compression Spring | | **Dimensions** | 45.00mm x 45.00mm | | **Height** | 25.00mm | --- ### 2. Design Breakdown The "maxiFLOW" design is unique compared to standard cross-cut heatsinks: * **Tapered Fin Design:** The fins are flared to maximize surface area while maintaining a low pressure drop, allowing for better airflow intake. * **pushPIN™ Attachment:** This model uses a plastic or brass pushPIN™ mechanism. It is designed to be quickly installed into pre-drilled holes on a PCB, ensuring consistent pressure for optimal thermal contact. * **Thermal Interface Material (TIM):** The "R0" suffix usually indicates that a high-performance thermal pad (T766) is pre-applied to the base of the heatsink. --- ### 3. Part Number Decoder Understanding the nomenclature helps in identifying specific variants: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **16F** | Family / Series (pushPIN™ Heatsink) | | **52** | Specific dimension/configuration code | | **C3** | Material / Finish (Black Anodized Aluminum) | | **R0** | Packaging / Thermal Interface revision | --- ### 4. Applications This part is commonly used in high-heat density environments where airflow is directed through the chassis, such as: * **Networking Gear:** Switches and Routers. * **Industrial PCs:** Compact embedded systems. * **Power Supplies:** Heat dissipation for MOSFETs and IGBTs.