The **ATS-16F-56-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from integrated circuits (ICs) and other electronic surface-mount devices. ### 1. Technical Specifications | Parameter | Specification | Details | | :--- | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | Part of the push-pin series. | | **Dimensions** | 35mm x 35mm x 10mm | (L x W x H) | | **Material** | Aluminum | Lightweight with high thermal conductivity. | | **Fin Style** | Straight Fin | Optimizes airflow in a single direction. | | **Attachment Method** | Push-Pin | Secure mechanical mounting via PCB holes. | | **Thermal Resistance** | ~6.70°C/W | Based on natural convection. | | **Coating/Finish** | Blue Anodized | Increases surface area and provides corrosion resistance. | --- ### 2. Key Components & Design Features #### A. The Fin Array (Straight Fin) The "Straight Fin" design is engineered for environments with consistent airflow. The spacing between the fins is calculated to minimize pressure drop while maximizing the surface area exposed to the air. #### B. Push-Pin Attachment Mechanism Unlike adhesive-based heat sinks, the **ATS-16F-56-C3-R0** uses a mechanical push-pin system: * **Reliability:** Provides constant pressure on the high-power component. * **Ease of Assembly:** Features a pre-installed spring-loaded pin that snaps into standardized holes on the PCB. #### C. Thermal Interface Material (TIM) This specific model usually comes with a pre-applied **Phase Change Material (PCM)** or a thermal pad on the base. This ensures there are no air gaps between the heat sink and the electronic chip, facilitating efficient heat transfer. --- ### 3. Part Number Breakdown The part number identifies the specific configuration of the unit: * **ATS:** Advanced Thermal Solutions (Manufacturer). * **16F:** Designates the specific fin pattern and series. * **56:** Internal size/geometry code. * **C3:** Material/Finish code (Blue Anodized). * **R0:** Revision or packaging indicator. --- ### 4. Application Use Cases This part is commonly used in the following electronic sectors: * **Telecommunications:** Cooling for network switches and routers. * **Computing:** Heat management for chipsets and secondary processors. * **Embedded Systems:** Industrial controllers where reliability under vibration is required (secured by pins rather than glue).