The **ATS-16F-70-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for precision cooling of electronic components like CPUs, GPUs, and high-power ICs. --- ## 1. Technical Specifications Below are the key physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 45mm x 45mm x 25mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 3.64 °C/W (at 100 LFM) | | **Fin Pattern** | Straight Fin | | **Thermal Interface Material** | T766 (Pre-applied) | --- ## 2. Key Design Features ### A. Fin Geometry (Straight Fin) The "Straight Fin" design is optimized for environments where there is a consistent, directional airflow. It offers a balance between surface area for heat dissipation and low pressure drop, ensuring the cooling fan doesn't have to work harder than necessary. ### B. pushPIN™ Attachment System Instead of using messy adhesives or bulky brackets, this part uses a spring-loaded pin mechanism: * **Compression Springs:** Ensure even pressure across the surface of the chip to maximize heat transfer. * **Secure Fit:** Prevents the heat sink from shifting during vibration or mechanical shock. ### C. Thermal Interface Material (TIM) The unit comes with **T766** material pre-applied to the base. This fills the microscopic air gaps between the heat sink and the electronic component, significantly reducing thermal resistance. --- ## 3. Component Breakdown | Part Component | Purpose | | :--- | :--- | | **Aluminum Body** | Provides high thermal conductivity at a lightweight and lower cost than copper. | | **Blue Anodized Coating** | Enhances radiative heat transfer and protects the aluminum from corrosion. | | **Brass Push Pins** | Durable mechanical fasteners that lock into standard PCB holes (usually 3.0mm). | --- ## 4. Application Use-Cases * **Telecommunications:** Cooling of high-speed network switches and routers. * **Embedded Systems:** Thermal management for industrial PC processors. * **Power Supplies:** Heat dissipation for MOSFETs and power regulators.