The **ATS-16F-76-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" attachment series designed for cooling integrated circuits (ICs). --- ### Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Number** | ATS-16F-76-C3-R0 | | **Thermal Resistance** | 1.23°C/W (at 200 LFM) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Brass) | | **Fin Type** | Straight Fin | | **Dimensions (L x W x H)** | 25mm x 25mm x 15mm | --- ### Key Components & Features #### 1. Material and Coating The heat sink is made from **Aluminum 6063**, which offers a high thermal conductivity-to-weight ratio. The **Blue Anodized** finish is not just for aesthetics; it provides surface protection against corrosion and slightly increases emissivity for better radiant heat transfer. #### 2. Fin Design This model uses a **Straight Fin** geometry. This design is optimized for environments where there is a consistent, unidirectional airflow (forced convection), allowing air to pass through the channels and carry heat away from the base. #### 3. Attachment Mechanism (Push Pin) The part utilizes a **Push Pin and Spring** system: * **Brass Push Pins:** Provides a durable, repeatable attachment. * **Springs:** Ensure constant, high pressure (interface pressure) between the heat sink and the electronic component, which is critical for minimizing thermal contact resistance. #### 4. Thermal Interface Material (TIM) The "R0" suffix typically indicates that the part comes pre-applied with a **Thermal Interface Material** (usually a phase-change material or high-performance thermal pad), ensuring that air gaps between the chip and the heat sink are filled immediately upon installation. --- ### Common Applications * **Networking Equipment:** High-speed routers and switches. * **Processors:** Cooling for CPUs, GPUs, or FPGAs with a 25mm footprint. * **Power Supplies:** Heat dissipation for power transistors and voltage regulators. ---