### ATS-16F-80-C3-R0 Technical Overview The **ATS-16F-80-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" heat sink series, designed specifically for cooling electronic components like CPUs, GPUs, or high-power semiconductors. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Heat Sink Type** | Push Pin / Cross-Cut Fin | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 30.00mm x 30.00mm x 25.00mm | | **Thermal Resistance** | 7.21°C/W (at 200 LFM) | | **Attachment Method** | Push Pin with Brass Springs | | **Thermal Interface** | T412 (Phase Change) | --- ### 2. Physical Design and Construction * **Cross-Cut Fin Pattern:** The unit features a square-pin fin pattern (often referred to as cross-cut). This allows for multidirectional airflow, meaning the cooling efficiency is less dependent on the specific direction the fan is blowing. * **Aluminum 6063:** This alloy is chosen for its excellent thermal conductivity and structural integrity. * **Blue Anodized Coating:** This is not just for aesthetics; the anodization provides surface protection against corrosion and slightly improves radiant heat transfer. --- ### 3. Mounting and Thermal Management #### Attachment Mechanism The **"R0"** in the part number indicates the specific mounting hardware: * **Push Pins:** Uses two plastic pins that snap into pre-drilled holes in the PCB. * **Compression Springs:** Brass springs provide consistent downward pressure, ensuring the heat sink stays flat against the component to maximize heat transfer. #### Thermal Interface Material (TIM) The unit comes pre-applied with **T412**, a high-performance phase-change material. * **Benefit:** Unlike traditional thermal grease, T412 is easier to handle during assembly and becomes liquid-like at operating temperatures to fill microscopic gaps between the chip and the heat sink. --- ### 4. Performance Data (Airflow) Thermal resistance decreases as the velocity of air (measured in Linear Feet per Minute - LFM) increases: | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (1.0 m/s)** | 7.21 | | **400 (2.0 m/s)** | 4.60 | | **600 (3.0 m/s)** | 3.84 | | **800 (4.0 m/s)** | 3.42 | --- ### Summary The **ATS-16F-80-C3-R0** is a mid-height, high-density cooling solution for 30mm components. It is best suited for industrial or server environments where active airflow is present and a secure, vibration-resistant mounting method (push pins) is required.