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  • ATS-16F-82-C3-R0

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    The **ATS-16F-82-C3-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. It is manufactured by *Advanced Thermal Solutions, Inc.* --- ### 1. Technical Specifications The following table highlights the core physical and thermal characteristics of this part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Thermal Resistance** | 2.50°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 30mm x 30mm x 25mm | | **Weight** | 35.0 grams | --- ### 2. Design and Construction The "F" in the part number denotes a **Fine Pitch** design, which increases the surface area available for heat dissipation. * **Fins:** It features a cross-cut pattern (matrix of pins) which allows for multi-directional airflow. This makes it ideal for systems where the direction of the fan exhaust might change or is not perfectly linear. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T412**, a high-performance thermal tape/pad that ensures efficient heat transfer from the component to the aluminum base. --- ### 3. Mechanical Integration The push-pin mechanism is a key feature of the `ATS-16` series: * **Spring-Loaded:** Provides a consistent "clamping force" to ensure the heatsink remains in contact with the chip, even during mechanical shock or vibration. * **Installation:** Requires pre-drilled holes in the PCB. The plastic pins snap into place, compressing the springs and locking the unit down. --- ### 4. Thermal Performance Data Performance varies based on the Airflow (Measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 2.50 | | 200 (1.0 m/s) | 1.45 | | 400 (2.0 m/s) | 1.10 | | 600 (3.0 m/s) | 0.95 | --- ### 5. Part Number Decoding The suffix provides specific details about the configuration: * **-C3:** Indicates the material and finish (usually high-performance thermal material with blue anodization). * **-R0:** Refers to the revision level or packaging standards (RoHS compliant).
    ✨ Follow-up Questions
    • ⤷What are the PCB hole size requirements for the push-pin mounting?
    • ⤷ How does 'Fine Pitch' compare to 'Ultra-Fine Pitch' in terms of airflow resistance?
    • ⤷ Can this heatsink be used on a BGA package without pre-drilled holes?