ATS-16F-82-C3-R0
AI

The **ATS-16F-82-C3-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. It is manufactured by *Advanced Thermal Solutions, Inc.*
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### 1. Technical Specifications
The following table highlights the core physical and thermal characteristics of this part:
| Characteristic | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Spring Loaded) |
| **Thermal Resistance** | 2.50°C/W (at 100 LFM) |
| **Dimensions (L x W x H)** | 30mm x 30mm x 25mm |
| **Weight** | 35.0 grams |
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### 2. Design and Construction
The "F" in the part number denotes a **Fine Pitch** design, which increases the surface area available for heat dissipation.
* **Fins:** It features a cross-cut pattern (matrix of pins) which allows for multi-directional airflow. This makes it ideal for systems where the direction of the fan exhaust might change or is not perfectly linear.
* **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T412**, a high-performance thermal tape/pad that ensures efficient heat transfer from the component to the aluminum base.
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### 3. Mechanical Integration
The push-pin mechanism is a key feature of the `ATS-16` series:
* **Spring-Loaded:** Provides a consistent "clamping force" to ensure the heatsink remains in contact with the chip, even during mechanical shock or vibration.
* **Installation:** Requires pre-drilled holes in the PCB. The plastic pins snap into place, compressing the springs and locking the unit down.
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### 4. Thermal Performance Data
Performance varies based on the Airflow (Measured in Linear Feet per Minute - LFM):
| Airflow Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 2.50 |
| 200 (1.0 m/s) | 1.45 |
| 400 (2.0 m/s) | 1.10 |
| 600 (3.0 m/s) | 0.95 |
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### 5. Part Number Decoding
The suffix provides specific details about the configuration:
* **-C3:** Indicates the material and finish (usually high-performance thermal material with blue anodization).
* **-R0:** Refers to the revision level or packaging standards (RoHS compliant).
- ⤷What are the PCB hole size requirements for the push-pin mounting?
- ⤷ How does 'Fine Pitch' compare to 'Ultra-Fine Pitch' in terms of airflow resistance?
- ⤷ Can this heatsink be used on a BGA package without pre-drilled holes?