The **ATS-16F-86-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** product line, designed to provide high-efficiency cooling for electronic components. --- ### 1. Technical Specifications The part number follows a specific nomenclature. Below are the primary technical characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 3.16°C/W (at 200 LFM) | | **Attachment Method** | pushPIN™ (Brass pins / Steel springs) | | **Dimensions (L x W x H)** | 45mm x 45mm x 15mm | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Component Breakdown #### A. The maxiFLOW™ Design The heat sink features a tapered fin design. Unlike traditional square fins, the maxiFLOW™ profile increases the surface area and encourages more turbulent airflow, which significantly reduces the thermal resistance (the ability to dissipate heat away from the chip). #### B. The pushPIN™ Attachment System The **-R0** suffix indicates a specific hardware configuration. This model uses the **pushPIN™** system: * **Ease of Assembly:** Uses a spring-loaded pin to secure the heat sink to the PCB. * **Constant Pressure:** Ensures uniform contact between the heat sink and the component (like a BGA or FPGA), maximizing heat transfer. * **Stability:** Provides vibration and shock resistance compared to simple adhesive tapes. #### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied. * This is a high-performance phase-change material or grease that fills microscopic air gaps between the heat sink and the electronic chip. * The pre-applied nature ensures consistency in manufacturing and reduces assembly time. --- ### 3. Typical Applications This specific heat sink is typically used for cooling high-power semiconductors in the following fields: 1. **Telecommunications:** Network switches and routers. 2. **Computing:** Server CPUs or high-speed memory controllers. 3. **Industrial:** Power supplies and motor controllers. 4. **Automotive:** ADAS (Advanced Driver Assistance Systems) processors. ---