The **ATS-16F-87-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to describe its physical and thermal characteristics. | Feature | Specification | Description | | :--- | :--- | :--- | | **Heat Sink Type** | pushPIN™ | Uses a spring-loaded attachment mechanism. | | **Material** | Aluminum | Provides excellent thermal conductivity and light weight. | | **Finish** | Blue Anodized | Enhances surface area and protects against corrosion. | | **Thermal Resistance** | 1.30°C/W (Unducted) | Measures the efficiency of heat transfer. | | **Dimensions** | 35mm x 35mm x 20mm | The footprint and height of the sink. | | **Fin Style** | Straight Fin | Optimized for linear airflow. | --- ### 2. Key Components & Features #### A. Thermal Interface Material (TIM) The "R0" suffix typically indicates that the part comes pre-applied with **T766** thermal phase change material or a high-performance thermal pad. This ensures there are no air gaps between the component and the heat sink. #### B. pushPIN™ Attachment Instead of using messy adhesives or simple clips, this model uses a **pushPIN™** system: * **Springs:** Provides consistent pressure to ensure optimal contact. * **Pins:** Available in brass or plastic to secure the sink to the PCB through pre-drilled holes. #### C. Fin Design The heat sink utilizes a **straight-fin** pattern. This is ideal for environments with a clear direction of airflow (e.g., directed by a system fan), as it allows air to pass through the channels with minimal pressure drop. --- ### 3. Application Use Cases This specific part is generally used in medium-power electronic assemblies where space is limited but thermal demands are high: * **Telecommunications:** Network switches and routers. * **Industrial PC:** Embedded systems requiring passive or active cooling. * **Power Supplies:** Cooling voltage regulators or MOSFETs. ---