The **ATS-16F-91-C1-R0** is a high-performance thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Dimensions (L x W)** | 40mm x 40mm | | **Height (Fin Depth)** | 10mm | | **Thermal Resistance** | 21.86°C/W (Unducted Flow @ 100 LFM) | | **Fin Pattern** | Straight | --- ### 2. Key Components & Design Features #### A. The Fin Array (Straight Fin) The "Straight Fin" design is optimized for environments where there is a consistent, directed airflow (ducted or high-velocity fan air). The spacing between the fins allows air to pass through and carry away heat via convection. #### B. pushPIN™ Attachment Unlike adhesive tapes or simple clips, this part uses a **Push-Pin** mechanism. This offers several advantages: * **Constant Pressure:** The integrated springs ensure consistent contact between the heat sink and the component surface. * **Reliability:** It is more resistant to vibration and thermal expansion than thermal tape. * **Pre-Drilled Holes:** Requires specific hole patterns on the PCB for installation. #### C. Material and Coating * **Aluminum:** Provides a lightweight solution with high thermal conductivity. * **Blue Anodized Finish:** Not only provides a professional aesthetic but also protects the aluminum from corrosion and slightly improves radiant heat emissivity. --- ### 3. Thermal Performance Profile Thermal resistance indicates how efficiently the part moves heat away from the silicon. Performance varies based on air velocity (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 21.86 | | 300 (1.5 m/s) | 10.18 | | 500 (2.5 m/s) | 6.48 | | 700 (3.5 m/s) | 5.33 | --- ### 4. Application Use-Case This specific heat sink is categorized as **Low Profile** (only 10mm height). It is ideal for: 1. **1U Servers:** Where vertical space is extremely limited. 2. **Network Switches:** Cooling localized ASICs or chipsets. 3. **Embedded Systems:** Industrial PCs where mechanical shock resistance (provided by the push-pins) is required.