ATS-16F-91-C3-R0
AI

The **ATS-16F-91-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors.
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### 1. Technical Specifications
The part number provides specific details about its physical and thermal characteristics:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) |
| **Series** | pushPIN™ |
| **Attachment Method** | Push-Pin (Plastic or Brass) |
| **Thermal Resistance** | 22.05°C/W (at 100 LFM / 0.5 m/s) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions** | 40mm x 40mm x 10mm |
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### 2. Physical Design Details
The "91" in the part number corresponds to a specific fin pattern and height profile:
* **Low Profile:** With a height of only 10mm, this heat sink is ideal for space-constrained applications (e.g., 1U server chassis or compact embedded systems).
* **Fin Pitch:** It typically features a fine-pitch design (straight fin) to maximize surface area for heat transfer.
* **Thermal Interface Material (TIM):** This specific model usually comes pre-applied with **T412**, which is a high-efficiency thermal tape or pad, ensuring low thermal resistance between the component and the sink.
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### 3. Attachment Mechanism: pushPIN™
One of the key features of this electronic part is the **pushPIN™** system. Instead of using messy glues or mechanical clips that require tools, this part uses:
1. **Spring-loaded pins:** Provide consistent pressure for optimal thermal contact.
2. **Pre-drilled PCB holes:** Requires the motherboard or PCB to have specific holes for mounting.
3. **Compression Springs:** These prevent the heat sink from shifting during vibration or shipping.
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### 4. Thermal Performance Data
Performance varies based on the airflow (measured in Linear Feet per Minute - LFM):
| Airflow (m/s) | LFM | Thermal Resistance (°C/W) |
| :--- | :--- | :--- |
| 0.5 | 100 | 22.05 |
| 1.0 | 200 | 12.85 |
| 2.0 | 400 | 7.00 |
| 3.0 | 600 | 5.30 |
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- ⤷What is the difference between the C1
- ⤷ C2
- ⤷ and C3 suffixes in ATS heat sinks?
- ⤷ What are the recommended PCB hole sizes for the pushPIN mounting system?
- ⤷ Is there a version of this heat sink with a higher profile for better cooling?