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  • ATS-16F-91-C3-R0

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    The **ATS-16F-91-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number provides specific details about its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 22.05°C/W (at 100 LFM / 0.5 m/s) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 40mm x 40mm x 10mm | --- ### 2. Physical Design Details The "91" in the part number corresponds to a specific fin pattern and height profile: * **Low Profile:** With a height of only 10mm, this heat sink is ideal for space-constrained applications (e.g., 1U server chassis or compact embedded systems). * **Fin Pitch:** It typically features a fine-pitch design (straight fin) to maximize surface area for heat transfer. * **Thermal Interface Material (TIM):** This specific model usually comes pre-applied with **T412**, which is a high-efficiency thermal tape or pad, ensuring low thermal resistance between the component and the sink. --- ### 3. Attachment Mechanism: pushPIN™ One of the key features of this electronic part is the **pushPIN™** system. Instead of using messy glues or mechanical clips that require tools, this part uses: 1. **Spring-loaded pins:** Provide consistent pressure for optimal thermal contact. 2. **Pre-drilled PCB holes:** Requires the motherboard or PCB to have specific holes for mounting. 3. **Compression Springs:** These prevent the heat sink from shifting during vibration or shipping. --- ### 4. Thermal Performance Data Performance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (m/s) | LFM | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 0.5 | 100 | 22.05 | | 1.0 | 200 | 12.85 | | 2.0 | 400 | 7.00 | | 3.0 | 600 | 5.30 | ---
    ✨ Follow-up Questions
    • ⤷What is the difference between the C1
    • ⤷ C2
    • ⤷ and C3 suffixes in ATS heat sinks?
    • ⤷ What are the recommended PCB hole sizes for the pushPIN mounting system?
    • ⤷ Is there a version of this heat sink with a higher profile for better cooling?