The **ATS-16F-99-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part number: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized Finish) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 11.49°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W)** | 45.00mm x 45.00mm | | **Height** | 20.00mm | | **Fin Type** | Fine Pitch (Cross-Cut) | --- ### 2. Component Breakdown #### A. The pushPIN™ Attachment System The "16F" in the part number indicates a specific push-pin design. This system provides: * **Constant Pressure:** A pre-assembled compression spring ensures consistent force and optimal thermal interface material (TIM) performance. * **Ease of Install:** No tools are required for mounting; the pins snap into pre-drilled holes on the PCB. #### B. Thermal Performance The efficiency of the ATS-16F-99-C1-R0 is measured by its **Thermal Resistance**. Lower values indicate better cooling. * **Low Airflow (100 LFM):** 11.49 °C/W * **High Airflow (700 LFM):** 1.70 °C/W * *Note: This shows the part is highly dependent on active airflow (fans) to be effective.* #### C. Material and Coating * **Aluminum 6063:** Offers a high strength-to-weight ratio and excellent thermal conductivity. * **Blue Anodized Finish:** Provides corrosion resistance and increases surface emissivity (aiding in radiation cooling), while also meeting aesthetic standards. --- ### 3. Application Use Cases This heat sink is typically found in: 1. **Telecommunications:** Networking switches and routers. 2. **Industrial Computing:** Embedded systems that require reliable heat dissipation in tight spaces. 3. **Power Supplies:** Cooling voltage regulators or power modules. ---