The **ATS-16G-101-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for secure and efficient cooling of surface-mount components like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications Below are the primary mechanical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Fin Type** | Straight Fin | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 30mm | | **Hole Pattern** | 38mm x 38mm | | **Thermal Resistance** | 1.02 °C/W (at 200 LFM) | | **Compliance** | RoHS and REACH Compliant | --- ### 2. Key Components & Features #### A. The pushPIN™ Attachment System This part uses a specialized attachment mechanism that includes: * **Brass/Plastic Push Pins:** Designed to fit into pre-drilled holes on the PCB. * **Compression Springs:** Provides consistent pressure (approximately 20 Newtons) across the interface to maximize heat transfer. #### B. Thermal Interface Material (TIM) The "C2" in the part number indicates that this unit comes pre-applied with **ATS-PPS-02** thermal grease. This eliminates the need for manual application during assembly and ensures a high-quality bond between the chip and the heat sink. #### C. Straight Fin Design The fins are arranged in a straight-line pattern. This design is optimized for **undirected airflow** or longitudinal air movement within a chassis. The 30mm height provides a large surface area for heat dissipation without creating excessive air impedance. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying its specific electronic role: * **ATS:** Advanced Thermal Solutions (Manufacturer). * **16G:** Series designation. * **101:** Specific geometry/fin configuration. * **C2:** Indicates the type of Thermal Interface Material (T766/Grease). * **R0:** Revision code. --- ### 4. Implementation Example In an electronic circuit design, this component is typically integrated into the CAD layout as follows: ```yaml Component_Type: Passive Cooling Board_Requirements: - 2x 3.17mm diameter holes - 38mm spacing (center-to-center) - Clear zone around the IC to prevent capacitor interference ```