The **ATS-16H-01-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions, Inc.** It belongs to the category of high-performance **Heat Sinks**, specifically designed for cooling integrated circuits (ICs) and other electronic components. ### 1. Component Overview The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-16H-01-C2-R0 | | **Category** | Thermal Management - Heat Sinks | | **Series** | pushPIN™ | | **Attachment Method** | Push-Pin | --- ### 2. Physical Characteristics This heat sink is designed for specific board layouts and space constraints. * **Dimensions:** 40mm x 40mm (Length x Width). * **Height:** 10mm (Low profile design). * **Material:** Aluminum. * **Finish:** Blue Anodized. * **Fin Type:** Straight Fin (optimized for unidirectional airflow). --- ### 3. Thermal Performance Thermal resistance determines how effectively the part dissipates heat away from the semiconductor. | Airflow Velocity | Thermal Resistance (Unducted) | Thermal Resistance (Ducted) | | :--- | :--- | :--- | | 100 LFM (0.5 m/s) | 21.90 °C/W | 3.60 °C/W | | 200 LFM (1.0 m/s) | 9.60 °C/W | — | | 300 LFM (1.5 m/s) | 6.20 °C/W | — | --- ### 4. Mounting and Interface The **ATS-16H-01-C2-R0** uses a specialized mechanical attachment system to ensure consistent pressure. * **Push-Pin Mounting:** Uses a spring-loaded pin mechanism that snaps into pre-drilled holes on the PCB. * **Spring Type:** Brass/Plastic/Steel options (standard for this series is high-tension steel). * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied, which is a high-performance thermal pad or grease to fill microscopic air gaps between the component and the sink. --- ### 5. Application Usage This part is commonly used in: 1. **Networking Hardware:** Routers, switches, and gateways. 2. **Embedded Systems:** Industrial PCs and controllers. 3. **Power Electronics:** Cooling MOSFETs or small voltage regulators. 4. **Processors:** Cooling chipsets on motherboards or GPU auxiliary components.