The **ATS-16H-101-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## Technical Specifications The following table outlines the physical and thermal properties of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions** | 45mm x 45mm x 30mm | | **Thermal Resistance** | 6.67°C/W (Unducted Flow @ 100 LFM) | | **Weight** | 102.13 grams | --- ## Component Breakdown ### 1. The Heat Sink Body The part uses a **Cross-Cut** fin design. Unlike straight fins, cross-cut fins allow for multi-directional airflow, making it highly effective in compact electronic enclosures where air may be turbulent or come from different angles. ### 2. Attachment Mechanism (pushPIN™) The "16H" and "R0" designations refer to the specific mounting hardware: * **Push-Pins:** Plastic pins that snap into pre-drilled holes on a Printed Circuit Board (PCB). * **Compression Springs:** These provide consistent pressure between the heat sink and the chip to maximize heat transfer. ### 3. Thermal Interface Material (TIM) The "C2" in the part number indicates that the heat sink comes pre-applied with **ATS-54**, a high-performance phase-change thermal material. This ensures there are no microscopic air gaps between the component and the heat sink. --- ## Performance Metrics Thermal resistance is the most critical electronic metric for this part. It measures how many degrees Celsius the component temperature will rise per watt of power dissipated. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 6.67 | | 300 (1.5 m/s) | 2.50 | | 500 (2.5 m/s) | 1.70 | *As airflow increases, the efficiency of the heat sink improves significantly.*