The **ATS-16H-101-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) to prevent thermal throttling or hardware failure. --- ### Technical Specifications The following table summarizes the key physical and thermal characteristics of this part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height (Fin Height)** | 30mm | | **Thermal Resistance** | 6.77°C/W (Unducted Flow @ 100 LFM) | | **Fin Pitch** | Fine Pitch | | **Fin Pattern** | Straight | --- ### Key Components & Design Features #### 1. Push-Pin Mounting System Unlike adhesive-based heat sinks, this model uses a **push-pin** mechanism. - **Reliability:** Provides consistent pressure on the component, improving thermal interface material (TIM) performance. - **Hardware:** Usually paired with a brass or plastic pin and a high-performance compression spring. #### 2. Material and Coating - **Aluminum (6063):** Offers a balance of lightweight properties and high thermal conductivity. - **Blue Anodized Finish:** This is not just aesthetic; anodizing increases the surface emissivity, slightly improving radiant heat transfer and providing corrosion resistance. #### 3. Fin Profile The "101" designation refers to a specific fin geometry designed for **Fine Pitch** applications. This maximizes the surface area within a compact 45x45mm footprint, making it ideal for high-density PCB layouts where airflow may be limited. --- ### Thermal Performance Reference Thermal resistance ($\theta$) determines how efficiently the part moves heat away from the chip. Performance varies based on airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 6.77 | | 300 (1.5 m/s) | 2.14 | | 500 (2.5 m/s) | 1.43 | --- ### Applications * **Processors (CPUs/GPUs):** Small form factor embedded processors. * **Telecommunications:** High-speed networking switches and routers. * **Power Electronics:** Dissipating heat from VRMs or large MOSFET arrays.