The **ATS-16H-80-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to their **maxiFLOW™** product line, designed to provide high thermal performance in environments with constrained airflow. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 30.00mm x 30.00mm | | **Height** | 15.00mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 19.03 °C/W (at 1.0 m/s) | | **Fin Style** | maxiFLOW (Tapered Fin) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Key Component Features ### A. maxiFLOW™ Fin Design Unlike standard straight-fin heat sinks, the maxiFLOW™ design features a **tapered fin structure**. This increases the surface area while reducing pressure drop, making it highly efficient for components that generate significant heat in tight spaces. ### B. pushPIN™ Attachment The part uses a specialized **pushPIN™** mounting system. This includes: * **Compression Springs:** Ensures even pressure across the processor or component for optimal heat transfer. * **Plastic/Brass Pins:** Secure the heat sink to the PCB via pre-drilled holes, providing a more reliable connection than adhesive tapes. ### C. Thermal Interface Material (TIM) The "C2" in the part number indicates the specific TIM used. * **T766:** This is a high-performance phase-change material or grease that fills microscopic air gaps between the component surface and the heat sink base to maximize thermal conductivity. --- ## 3. Part Number Breakdown (Nomenclature) Understanding the code **ATS-16H-80-C2-R0**: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **16H** | Series/Product Family (maxiFLOW) | | **80** | Specific Fin and Body configuration | | **C2** | Thermal Interface Material (T766) | | **R0** | RoHS Compliance and revision status | --- ## 4. Typical Applications This component is commonly used to cool: * **Microprocessors (CPUs)** and **FPGAs** * **ASICs** in networking equipment * High-speed memory modules * Power converters and LED drivers ---