The **ATS-16H-85-C2-R0** is a specific part number for a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their *push-pin* attachment line, designed for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 8.98°C/W (at 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Physical Dimensions The physical footprint is critical for PCB layout and clearance: * **Length:** 35.00 mm * **Width:** 35.00 mm * **Height:** 10.00 mm * **Fin Style:** Straight Fin --- ### 3. Component Breakdown #### A. The Heat Sink (Aluminum) The body is made of aluminum, which provides a high thermal conductivity-to-weight ratio. The **Blue Anodized** coating increases surface emissivity and protects the aluminum from corrosion. #### B. The Attachment (Push-Pin & Spring) Unlike adhesive-based heatsinks, this model uses a mechanical **Push-Pin** system. * **Reliability:** Mechanical fasteners provide consistent pressure over the lifecycle of the product. * **Springs:** The compression springs ensure that the heatsink remains flush against the chip even under mechanical vibration or thermal expansion. #### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied. This is a "Phase Change" or high-performance thermal pad that fills microscopic air gaps between the component and the heatsink to maximize heat transfer. --- ### 4. Decoding the Part Number | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **16H** | Series Identifier (Push-pin style) | | **85** | Specific footprint/fin configuration | | **C2** | Thermal performance/Material grade | | **R0** | Revision code / RoHS Compliance | --- ### 5. Application Use-Cases * **Telecommunications:** Cooling ASICs in routers and switches. * **Embedded Systems:** Industrial PCs where high vibration might cause adhesive heatsinks to fall off. * **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators.