The **ATS-16H-99-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for securing cooling solutions to Printed Circuit Boards (PCBs). ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 20.00mm | | **Thermal Resistance** | 11.52°C/W (at 100 LFM) | | **Fin Type** | Straight Fin | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### Key Components and Design Features #### 1. Material and Coating * **Aluminum Construction:** Aluminum provides a high thermal conductivity-to-weight ratio, making it ideal for cooling integrated circuits without adding excessive mass. * **Blue Anodized Finish:** The anodization process increases corrosion resistance and electrical insulation. It also slightly improves radiative heat transfer. #### 2. Attachment Mechanism (Push-Pins) Unlike adhesive-based heat sinks, the **ATS-16H-99-C2-R0** uses a mechanical push-pin system: * **Spring-Loaded:** Provides constant pressure (Force) on the component, ensuring a tight bond and efficient heat transfer. * **Reliability:** Mechanical fasteners are preferred in high-vibration environments where adhesives might fail over time. #### 3. Thermal Performance The heat sink is designed for **forced air cooling** environments. Its efficiency is measured by thermal resistance: * **High Airflow:** At 500 LFM (Linear Feet per Minute), resistance drops significantly (approx. 2.10°C/W), allowing it to handle high-power chips. * **Low Airflow:** In natural convection (0 LFM), it is less effective, as its fin density is optimized for moving air. #### 4. Thermal Interface Material (TIM) The part comes with **T766** pre-applied. This is a phase-change material or high-performance pad that fills the microscopic air gaps between the heat sink base and the electronic component (CPU, FPGA, or GPU), maximizing heat conduction. --- ### Typical Applications * **Power Supplies:** Cooling MOSFETs and voltage regulators. * **Networking Gear:** Cooling high-speed processors in routers and switches. * **Industrial PCs:** Thermal management for embedded systems.