The **ATS-17B-06-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed for high-velocity airflow environments. --- ## 🛠️ Technical Specifications | Parameter | Details | | :--- | :--- | | **Part Number** | ATS-17B-06-C2-R0 | | **Category** | Thermal Management - Heat Sinks | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Anodized Blue) | | **Attachment Method** | pushPIN™ (Brass Pins) | | **Thermal Resistance** | 2.03°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 45.00mm x 40.00mm x 25.00mm | --- ## ⚡ Electronic & Design Features ### 1. maxiFLOW™ Fin Geometry The "Electronic Part" design features a **fluted fin structure**. Unlike standard square fins, these are tapered to maximize surface area and improve airflow intake. This reduces the "pressure drop" across the component, allowing heat to dissipate more efficiently even in crowded PCB layouts. ### 2. pushPIN™ Attachment System This specific model uses the **pushPIN™** mechanism, which consists of: * **Compression Springs:** Provides precise pressure to ensure the thermal interface material (TIM) is fully engaged with the chip. * **Brass Pins:** Offers high durability for secure mounting to the PCB. * **Plastic/Brass options:** The "R0" suffix generally indicates specific hardware sets for standard PCB holes. ### 3. Material and Coating * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodized Finish:** This is not just for aesthetics; the anodized layer provides increased corrosion resistance and slightly improves radiative heat transfer. --- ## 📈 Performance Data (Airflow) The efficiency of this heat sink is highly dependent on the velocity of the air provided by system fans (measured in Linear Feet per Minute - LFM). | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 2.03 | | 400 (2.0 m/s) | 1.10 | | 600 (3.0 m/s) | 0.84 | --- ## 📦 Typical Applications This component is designed to cool high-heat electronic devices such as: * **FPGA & ASIC:** High-speed processing units. * **Processors (CPUs):** Embedded systems requiring active cooling. * **Power Modules:** High-density power supplies and converters.