### Electronic Specifications: ATS-17B-08-C2-R0 The **ATS-17B-08-C2-R0** is a high-performance push-pin style heatsink manufactured by **Advanced Thermal Solutions (ATS)**. It is specifically designed for cooling electronic components such as BGA (Ball Grid Array) chips, CPUs, and GPUs on PCBs. --- ### 1. Technical Specifications The following table summarizes the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 45mm x 45mm | | **Height** | 15mm | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Brass | | **Thermal Interface Material (TIM)** | T766 (Pre-applied phase change material) | | **Thermal Resistance** | 14.61° C/W (@ 100 LFM / 0.5 m/s) | | **Fin Pattern** | Straight Fin | --- ### 2. Electronic/Thermal Performance In electronics, thermal management is critical to prevent "thermal throttling" or component failure. The performance of this part depends heavily on the airflow (LFM - Linear Feet per Minute): * **Low Airflow (100 LFM):** Thermal Resistance is **14.61° C/W**. * **High Airflow (700 LFM):** Thermal Resistance drops to **2.40° C/W**. **Electrical Isolation:** The "Blue Anodized" finish provides a thin layer of non-conductive oxidation, which prevents accidental short circuits if the heatsink touches nearby surface-mount components, though it is primarily for corrosion resistance and thermal emissivity. --- ### 3. Component Breakdown #### A. Thermal Interface Material (TIM) The part comes with **T766** pre-applied. This is a high-performance thermal pad that fills the microscopic air gaps between the electronic chip (IC) and the aluminum base of the heatsink, ensuring maximum heat transfer. #### B. Mounting Hardware (The Push-Pin) The "R0" designation refers to the specific attachment kit. * **Plastic Push-Pins:** Used to secure the heatsink through pre-drilled holes in the PCB. * **Compression Springs:** Provides consistent downward pressure to ensure the TIM stays in contact with the component during thermal expansion/contraction cycles. --- ### 4. Typical Applications * **ASICs and FPGAs:** Used in networking hardware where high-speed processing generates significant heat. * **Power Supplies:** Cooling voltage regulators or power transistors. * **Embedded Systems:** Industrial PCs or IoT gateways with limited space (due to the low 15mm profile).