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  • ATS-17B-100-C2-R0

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    The **ATS-17B-100-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series designed for electronic component cooling, specifically for Integrated Circuits (ICs), CPUs, and high-density PCB components. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Property | Value / Description | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 45mm x 45mm x 25mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 1.15 °C/W (@ 1.0 m/s flow) | | **Weight** | 68.0 grams | | **Fins** | XC (Cross-cut) design | --- ### 2. Key Electronic Features #### A. Thermal Management (Heat Dissipation) The primary role of this part in an electronic circuit is to manage the thermal junction temperature. By providing a thermal resistance of **1.15 °C/W**, it allows the semiconductor to operate at higher power levels without exceeding its maximum rated operating temperature (Tj). #### B. The pushPIN™ Attachment System Unlike adhesive-based heat sinks, the ATS-17B-100-C2-R0 uses a mechanical attachment system: * **Brass Springs:** Ensures constant pressure on the electronic component, improving thermal interface material (TIM) performance. * **Plastic Push Pins:** Allows for easy assembly and disassembly for maintenance. #### C. Cross-Cut (XC) Fin Design The "XC" designation indicates a cross-cut pattern. In electronics, this is critical because: * It supports **multi-directional airflow**, meaning the heat sink is effective regardless of whether the fan is blowing horizontally or vertically. * It increases surface area without significantly increasing the weight of the PCB assembly. --- ### 3. Application Use Cases * **Telecommunications:** Used on high-speed networking switches and routers. * **Embedded Systems:** Cooling for ARM or FPGA processors in industrial computers. * **Power Supplies:** Heat dissipation for MOSFETs or IGBT modules. --- ### 4. Mounting Hole Diagram To integrate this into a PCB design, the following spacing is required: ```text PCB Hole Layout: [45mm x 45mm Body] (o) <---- 38.0mm ----> (o) | | 38.0mm 38.0mm | | (o) <----------------> (o) ```
    ✨ Follow-up Questions
    • ⤷ What are the advantages of blue anodized finishes in electronics cooling?
    • ⤷ How does cross-cut fin geometry compare to straight fin geometry?
    • ⤷ What thermal interface material (TIM) is recommended for this heat sink?