ATS-17B-100-C2-R0
AI

The **ATS-17B-100-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series designed for electronic component cooling, specifically for Integrated Circuits (ICs), CPUs, and high-density PCB components.
---
### 1. Technical Specifications
The part number encodes specific physical and thermal characteristics:
| Property | Value / Description |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Dimensions** | 45mm x 45mm x 25mm |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 1.15 °C/W (@ 1.0 m/s flow) |
| **Weight** | 68.0 grams |
| **Fins** | XC (Cross-cut) design |
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### 2. Key Electronic Features
#### A. Thermal Management (Heat Dissipation)
The primary role of this part in an electronic circuit is to manage the thermal junction temperature. By providing a thermal resistance of **1.15 °C/W**, it allows the semiconductor to operate at higher power levels without exceeding its maximum rated operating temperature (Tj).
#### B. The pushPIN™ Attachment System
Unlike adhesive-based heat sinks, the ATS-17B-100-C2-R0 uses a mechanical attachment system:
* **Brass Springs:** Ensures constant pressure on the electronic component, improving thermal interface material (TIM) performance.
* **Plastic Push Pins:** Allows for easy assembly and disassembly for maintenance.
#### C. Cross-Cut (XC) Fin Design
The "XC" designation indicates a cross-cut pattern. In electronics, this is critical because:
* It supports **multi-directional airflow**, meaning the heat sink is effective regardless of whether the fan is blowing horizontally or vertically.
* It increases surface area without significantly increasing the weight of the PCB assembly.
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### 3. Application Use Cases
* **Telecommunications:** Used on high-speed networking switches and routers.
* **Embedded Systems:** Cooling for ARM or FPGA processors in industrial computers.
* **Power Supplies:** Heat dissipation for MOSFETs or IGBT modules.
---
### 4. Mounting Hole Diagram
To integrate this into a PCB design, the following spacing is required:
```text
PCB Hole Layout:
[45mm x 45mm Body]
(o) <---- 38.0mm ----> (o)
| |
38.0mm 38.0mm
| |
(o) <----------------> (o)
```
- ⤷
What are the advantages of blue anodized finishes in electronics cooling?
- ⤷ How does cross-cut fin geometry compare to straight fin geometry?
- ⤷ What thermal interface material (TIM) is recommended for this heat sink?