The **ATS-17B-124-C2-R0** is a high-performance electronic component specifically categorized as a **Heat Sink**. It is manufactured by *Advanced Thermal Solutions (ATS)* and belongs to their "push-pin" series designed for cooling Integrated Circuits (ICs) and other PCB-mounted components. --- ### 1. Technical Specifications | Parameter | Specification | |:---|:---| | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Number** | ATS-17B-124-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (with springs) | | **Thermal Resistance** | 3.20°C/W (at 200 LFM) | | **Flow Orientation** | Vertical / Omni-directional (XC series) | --- ### 2. Key Physical Dimensions Proper fitment is critical for heat sinks to ensure they do not interfere with surrounding electronic components. * **Width/Length:** 50.00mm x 50.00mm (Base footprint) * **Height:** 25.00mm (Distance from the top of the chip) * **Pitch:** 43.00mm (The spacing between the mounting holes) --- ### 3. Electronic Design Features * **XC (Cross-Cut) Fin Design:** Unlike straight-fin heat sinks, the "XC" series uses a square-pin/cross-cut pattern. This allows for airflow from any direction (omni-directional), making it ideal for enclosures with unpredictable air currents. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T766** phase-change material or a high-performance thermal pad to bridge the microscopic air gaps between the heat sink and the electronic component. * **Push-Pin Attachment:** The part includes a brass push-pin with a stainless steel spring. This provides a precise and consistent pressure (load) on the electronic chip, which optimizes heat transfer and prevents mechanical damage to the solder joints. --- ### 4. Typical Applications This component is used to cool high-power electronic devices that generate significant heat during operation, such as: 1. **CPUs and Microcontrollers:** High-speed embedded processors. 2. **FPGAs/ASICs:** Field Programmable Gate Arrays used in networking or crypto-mining. 3. **Power Converters:** High-wattage DC-DC converters on a PCB. 4. **Graphics Processors:** Small-form-factor GPU cooling. ---