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  • ATS-17B-147-C2-R0

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    The part number **ATS-17B-147-C2-R0** refers to a high-performance **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push-pin" thermal management series designed for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ### ## Technical Specifications The following table outlines the mechanical and thermal properties of this specific component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Base Series** | pushPIN™ | | **Thermal Resistance** | 6.73°C/W (at 100 LFM) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Fin Style** | Straight Fin | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 10.00mm | | **Flow Orientation** | Vertical | --- ### ## Component Breakdown To understand the part, we can break down the SKU nomenclature used by ATS: 1. **ATS-17B**: Refers to the specific series and mounting hole configuration (Standard push-pin design). 2. **147**: The specific model number identifying the fin density and geometry. 3. **C2**: Indicates the **Thermal Interface Material (TIM)**. In this case, it usually signifies **T766** (a high-performance thermal grease or pad) pre-applied to the base. 4. **R0**: Refers to the revision and packaging (Standard RoHS compliant version). ### ## Features and Applications * **Heat Dissipation:** The straight fin design is optimized for high-velocity airflows (active cooling via fans). * **Push-Pin Mounting:** Uses a brass or plastic push-pin with a compression spring to ensure even pressure across the electronic component, improving heat transfer. * **Material:** The aluminum construction provides a balance between lightweight design and high thermal conductivity. * **Target Electronics:** Commonly used on **BGA (Ball Grid Array)** components, small form-factor processors, and power modules. --- ### ## Performance Data (Airflow) | Air Velocity (LFM) | 100 | 200 | 300 | 400 | 500 | | :--- | :--- | :--- | :--- | :--- | :--- | | **Thermal Resistance (°C/W)** | 6.73 | 3.91 | 3.12 | 2.71 | 2.45 |
    ✨ Follow-up Questions
    • ⤷ What are the compatible PCB hole sizes for the push-pin mounting on this heat sink?
    • ⤷ Can this heat sink be used with a different thermal interface material than the pre-applied T766?
    • ⤷ How does the straight fin design compare to a cross-cut fin design for this model?