ATS-17B-147-C2-R0
AI

The part number **ATS-17B-147-C2-R0** refers to a high-performance **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push-pin" thermal management series designed for cooling electronic components like CPUs, GPUs, or high-power transistors.
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### ## Technical Specifications
The following table outlines the mechanical and thermal properties of this specific component:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Base Series** | pushPIN™ |
| **Thermal Resistance** | 6.73°C/W (at 100 LFM) |
| **Material** | Aluminum (Blue Anodized) |
| **Attachment Method** | Push-Pin (Spring Loaded) |
| **Fin Style** | Straight Fin |
| **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 10.00mm |
| **Flow Orientation** | Vertical |
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### ## Component Breakdown
To understand the part, we can break down the SKU nomenclature used by ATS:
1. **ATS-17B**: Refers to the specific series and mounting hole configuration (Standard push-pin design).
2. **147**: The specific model number identifying the fin density and geometry.
3. **C2**: Indicates the **Thermal Interface Material (TIM)**. In this case, it usually signifies **T766** (a high-performance thermal grease or pad) pre-applied to the base.
4. **R0**: Refers to the revision and packaging (Standard RoHS compliant version).
### ## Features and Applications
* **Heat Dissipation:** The straight fin design is optimized for high-velocity airflows (active cooling via fans).
* **Push-Pin Mounting:** Uses a brass or plastic push-pin with a compression spring to ensure even pressure across the electronic component, improving heat transfer.
* **Material:** The aluminum construction provides a balance between lightweight design and high thermal conductivity.
* **Target Electronics:** Commonly used on **BGA (Ball Grid Array)** components, small form-factor processors, and power modules.
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### ## Performance Data (Airflow)
| Air Velocity (LFM) | 100 | 200 | 300 | 400 | 500 |
| :--- | :--- | :--- | :--- | :--- | :--- |
| **Thermal Resistance (°C/W)** | 6.73 | 3.91 | 3.12 | 2.71 | 2.45 |
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What are the compatible PCB hole sizes for the push-pin mounting on this heat sink?
- ⤷ Can this heat sink be used with a different thermal interface material than the pre-applied T766?
- ⤷ How does the straight fin design compare to a cross-cut fin design for this model?