The **ATS-17B-16-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" family, designed for cooling integrated circuits (ICs) and other PCB-mounted components. --- ### 1. Technical Specifications Below are the primary mechanical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded plastic pins) | | **Thermal Resistance (Flowing)** | 1.83 °C/W @ 100 LFM | | **Thermal Resistance (Static)** | 4.90 °C/W | | **Weight** | 35.0 grams | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 10.00mm | --- ### 2. Key Electronic Features #### A. Advanced Thermal Interface Material (TIM) The "C2" suffix indicates that this model comes pre-applied with **T766 Phase Change Material**. This is critical for electronics because: * It fills microscopic air gaps between the heat sink and the chip. * It provides high thermal conductivity without the mess of manual thermal paste application. #### B. Cross-Cut Fin Design The fin structure is designed for **omni-directional airflow**. In complex electronic enclosures where air may be pushed from multiple angles, the cross-cut pattern ensures that heat is dissipated efficiently regardless of the fan orientation. #### C. PushPIN™ Mounting System Instead of using messy adhesives or permanent solder, this part uses a mechanical push-pin system. * **Reliability:** Provides consistent pressure (measured by a precise spring) to ensure optimal contact with the electronic component. * **Maintenance:** Allows for easy removal and replacement of the electronic part or the heat sink during repairs. --- ### 3. Application Use-Cases This specific heat sink is typically used for cooling the following electronic parts: 1. **Processors (CPUs/GPUs):** Low-profile cooling for embedded systems. 2. **ASICs & FPGAs:** High-speed logic gates that generate significant heat in telecommunications equipment. 3. **Power Electronics:** Large MOSFETs or power regulators in industrial power supplies. ---