### Electronic Specifications: ATS-17B-166-C3-R0 The **ATS-17B-166-C3-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed to provide efficient thermal management for electronic components like CPUs, GPUs, and power transistors. --- ### 1. Technical Specifications The following table highlights the physical and thermal properties of this specific model: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance (Unducted)** | 12.30 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 2.73 °C/W @ 100 LFM | | **Dimensions (L x W x H)** | 25mm x 25mm x 15mm | | **Pitch** | Fine Pitch | | **Pattern** | XC (Cross-Cut) | --- ### 2. Key Components & Design The "Electronic" functionality of this part is passive, focusing on the dissipation of heat generated by active electronic circuits. * **XC (Cross-Cut) Fin Design:** The fin structure is designed to maximize surface area while allowing for multi-directional airflow. This is critical for dense PCB layouts where airflow direction may not be consistent. * **Push-Pin Attachment:** The part uses a spring-loaded mechanism. This ensures a consistent **pressure (Load)** between the heat sink and the electronic chip, which is vital for maintaining a low thermal interface resistance. * **Thermal Interface Material (TIM):** The "-R0" suffix typically denotes that the unit comes pre-applied with a high-performance thermal interface material (T37-2), which fills microscopic air gaps between the chip and the heat sink. --- ### 3. Thermal Performance Profile The effectiveness of this heat sink depends on the airflow (Measured in Linear Feet per Minute - LFM) within the electronic enclosure: | Airflow (LFM) | Velocity (m/s) | Resistance (Unducted) | Resistance (Ducted) | | :--- | :--- | :--- | :--- | | 100 | 0.5 | 12.30 °C/W | 2.73 °C/W | | 300 | 1.5 | 5.82 °C/W | 1.86 °C/W | | 500 | 2.5 | 4.47 °C/W | 1.59 °C/W | | 700 | 3.5 | 3.82 °C/W | 1.43 °C/W | --- ### 4. Application Context This part is commonly used in: 1. **Network Switches:** Cooling ASICs and FPGA chips. 2. **Power Supplies:** Dissipating heat from MOSFETs. 3. **Embedded Systems:** Managing thermals for small-form-factor industrial PCs.