The **ATS-17B-18-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for securing cooling solutions directly to Printed Circuit Boards (PCBs). ### 1. Technical Specifications Below is a breakdown of the electronic and physical properties of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 13.38°C/W (at 1.0 m/s airflow) | | **Dimensions (L x W)** | 54.00mm x 54.00mm | | **Height** | 15.00mm | | **Fin Style** | Straight Fin | --- ### 2. Electronic Component Breakdown #### A. Thermal Management Role In an electronic circuit, this part acts as a **passive heat exchanger**. It increases the surface area of a high-power semiconductor (like a CPU, FPGA, or Power MOSFET), allowing the ambient air to carry away heat more efficiently. The "C2" in the part number indicates a specific thermal interface material (TIM) or finish requirement. #### B. Mounting Mechanism The **Push-Pin** system is critical for electronic assembly: * **Compression Springs:** These provide a precise amount of "clamping force" to ensure the heat sink makes solid contact with the electronic chip. * **Acoustic/Vibration Stability:** The push-pin design is often preferred in industrial electronics because it remains secure during shipping or machine vibration compared to adhesive tapes. #### C. Material Science * **Aluminum:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodizing:** This is not just for aesthetics; the anodized layer provides a small amount of electrical insulation and protects the aluminum from corrosion in various environments. --- ### 3. Usage Context This specific part is typically found in: 1. **Telecommunications Equipment:** For cooling high-speed signal processors. 2. **Embedded Systems:** Industrial PCs where vertical space is limited (15mm height). 3. **Power Supplies:** To dissipate heat from voltage regulators. ---