The **ATS-17B-192-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Base Dimensions** | 45.00 mm x 45.00 mm | | **Height** | 30.00 mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | ~2.35°C/W (at 200 LFM) | --- ### 2. Key Component Features #### A. The pushPIN™ Attachment System The "R0" suffix often indicates the specific attachment kit. This heat sink uses a spring-loaded push-pin mechanism. - **Purpose:** Ensures consistent pressure (clamping force) between the heat sink and the electronic chip. - **Benefit:** Improves thermal interface material (TIM) performance and prevents the heat sink from shifting during vibration. #### B. Blue Anodized Finish - **Protection:** Provides corrosion resistance for the aluminum base. - **Performance:** Anodizing slightly increases the emissivity of the surface, which marginally improves heat dissipation through radiation, though convection remains the primary cooling method. #### C. Straight Fin Design - **Airflow:** Optimized for "Longitudinal" airflow. - **Application:** Best used in environments where there is a clear, directional path for air to move across the fins (e.g., inside a server chassis or near a cooling fan). --- ### 3. Thermal Performance Profile The effectiveness of this part depends heavily on the airflow (measured in Linear Feet per Minute - LFM). | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Unducted) | 4.43 | | 200 (Unducted) | 2.35 | | 400 (Unducted) | 1.51 | | 600 (Unducted) | 1.13 | --- ### 4. Typical Applications This specific size and thermal profile are commonly found in: 1. **Telecommunications:** High-speed routers and switches. 2. **Industrial PC:** Embedded systems requiring passive or active cooling. 3. **Power Supplies:** Dissipating heat from MOSFETs or Voltage Regulators.