The **ATS-17B-199-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ## Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-17B-199-C2-R0 | | **Heat Sink Type** | Push-Pin (Passive Cooling) | | **Fin Style** | Straight Fin | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin with Springs | | **Thermal Resistance** | 15.83°C/W (Unducted @ 100 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ## Key Components & Features ### 1. The Fin Structure (Straight Fin) The "Straight Fin" design is optimized for environments where airflow is directed through the fins. The spacing allows for efficient heat transfer to the surrounding air via convection. ### 2. Push-Pin Attachment Mechanism Instead of using adhesive tape or screws, this part uses a **spring-loaded push-pin system**. * **Purpose:** Ensures consistent pressure between the heat sink and the electronic component (IC). * **Safety:** The springs prevent over-tightening which could crack a delicate silicon die. * **Material:** The pins are usually made of brass or plastic, while the springs are stainless steel. ### 3. Material and Finish * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodized Coating:** This is not just for aesthetics; anodizing increases surface emissivity and provides a layer of protection against corrosion and electrical conductivity. ### 4. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. * **Function:** It fills microscopic air gaps between the chip and the heat sink. * **Efficiency:** This reduces the contact resistance, allowing heat to flow more freely into the aluminum body. --- ## Physical Dimensions | Dimension | Value | | :--- | :--- | | **Length/Width** | 50.00mm x 50.00mm | | **Height** | 6.00mm | | **Pitch** | Variable based on fin density | --- ## Typical Applications * **Embedded Systems:** Cooling for ARM-based processors or FPGAs. * **Networking:** Heat dissipation for switch fabric chips or routers. * **Power Electronics:** Cooling MOSFETs or Voltage Regulators in compact enclosures.