The **ATS-17B-22-C2-R0** is a specific electronic component primarily classified as a **High-Performance Heat Sink**. It is manufactured by *Advanced Thermal Solutions (ATS)* and belongs to their "blue ice" or high-efficiency push-pin series. Below is the technical breakdown of its electronic and mechanical specifications. --- ### ## 1. Technical Specifications Table | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Base Part Number** | ATS-17B-22-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 13.87°C/W (Unducted Flow @ 200 LFM) | | **Dimensions (L x W x H)** | 54mm x 54mm x 12.7mm | | **Fin Style** | Straight Fin | --- ### ## 2. Core Electronic Functions While the device itself does not consume electricity, it is an essential **thermal management component** for high-power electronic circuits. * **Heat Dissipation:** Its primary role is to transfer heat away from high-temperature surface-mount components (like CPUs, FPGAs, or MOSFETs) to the surrounding air. * **Thermal Interface:** It is designed to be paired with **Phase Change Material (PCM)** or thermal grease to minimize the air gap between the chip and the aluminum base. * **EMI Shielding (Partial):** By grounding the heat sink through specific mounting points, it can sometimes assist in reducing Electromagnetic Interference (EMI) radiating from a chip. --- ### ## 3. Key Features and Naming Convention The part number follows a specific logic used by ATS: 1. **ATS-17:** Refers to the specific series of the heat sink profile. 2. **B:** Represents the specific revision or mechanical variation. 3. **22:** Refers to the physical dimensions/footprint size. 4. **C2:** Denotes the **Thermal Interface Material (TIM)** provided; C2 typically indicates a high-performance thermal pad pre-applied to the base. 5. **R0:** Indicates the RoHS compliance status (Lead-free/Environmentally friendly). --- ### ## 4. Application Use Cases * **Voltage Regulators:** Cooling high-amperage power conversion modules. * **Networking Equipment:** Used on switches and routers for cooling processing ASICs. * **Embedded Computing:** Small form factor motherboards where vertical space is limited (12.7mm height).