ATS-17B-24-C2-R0
AI

The **ATS-17B-24-C2-R0** is a specific electronic cooling component, categorized as a high-performance **Heat Sink**. It is manufactured by *Advanced Thermal Solutions (ATS)* as part of their "push-pin" series designed for cooling integrated circuits (ICs) and other electronic chips.
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## Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Part Series** | pushPIN™ |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Brass) |
| **Thermal Resistance** | 5.88 °C/W (at 100 LFM) |
| **Dimensions (L x W)** | 60.00 mm x 60.00 mm |
| **Height (Height Off Base)** | 20.00 mm |
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## Key Design Components
### 1. Fin Profile (Straight Fin)
The "17B" designation refers to the specific fin pattern. These are **straight fins**, which are ideal for high-velocity airflow environments where air can be forced through the channels to dissipate heat efficiently.
### 2. Push-Pin Attachment
Instead of using messy thermal adhesives or tapes, this model uses a **mechanical push-pin system**.
* **Springs:** Pre-assembled with a high-performance compression spring.
* **Reliability:** Provides consistent pressure across the chip surface, improving thermal transfer.
### 3. Material and Coating
* **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties.
* **Blue Anodized Finish:** This is not just for aesthetics; the anodization layer provides corrosion resistance and slightly improves thermal emissivity.
### 4. Thermal Interface Material (TIM)
The "C2" suffix typically indicates that the heat sink comes pre-applied with **ATS-PPS-2** thermal grease or a similar high-performance phase-change material to ensure no air gaps exist between the chip and the heat sink.
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## Performance Metrics
Thermal resistance is measured in **°C/W** (Degrees Celsius per Watt). A lower number means better cooling performance.
* **Unducted Flow:** 5.88 °C/W @ 100 LFM (Linear Feet per Minute).
* **Ducted Flow:** 1.33 °C/W @ 100 LFM.
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- ⤷
What are the mounting hole requirements for the ATS-17B-24-C2-R0?
- ⤷ How does 'Ducted' vs 'Unducted' flow impact the cooling efficiency of this part?
- ⤷ Are there alternative attachment methods if my PCB doesn't support push-pins?