The **ATS-17B-29-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" family, designed for cooling integrated circuits (ICs) and other electronic components. ### 1. Technical Specifications Below are the primary mechanical and thermal properties of this specific part number: | Specification | Details | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 20mm | | **Thermal Resistance** | 7.57°C/W (at 100 LFM) | | **Fin Style** | Straight | | **Fin Pattern** | XCUT | --- ### 2. Key Components & Design Features #### A. The Heat Sink Body The body is made of **Aluminum**, which is chosen for its excellent thermal conductivity-to-weight ratio. The **XCUT** fin design increases surface area and improves airflow efficiency, making it suitable for high-density electronic assemblies. #### B. PushPIN™ Attachment System Unlike traditional adhesives, this part uses the pushPIN™ mechanism: * **Spring-loaded:** Ensures consistent pressure between the heat sink and the electronic component (CPU/GPU/FPGA). * **Security:** Provides a more permanent and vibration-resistant mechanical connection compared to thermal tape. #### C. Thermal Interface Material (TIM) The "R0" at the end of the part number indicates the specific thermal interface material. In this series, it typically comes pre-applied with **T766**, a high-performance thermal grease that fills microscopic air gaps between the heat sink and the chip to maximize heat transfer. --- ### 3. Part Number Breakdown (Nomenclature) To understand exactly what the electronic part represents, we can deconstruct the ID: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **17** | Series Identifier | | **B** | Material Code | | **29** | Specific Geometry/Fin Profile | | **C2** | Thermal Performance Grade | | **R0** | Pre-applied Thermal Interface Material / Finish | --- ### 4. Application Use Cases This part is commonly found in: * **Networking Equipment:** High-speed routers and switches. * **Industrial PCs:** Cooling processors in fanless or low-airflow environments. * **Power Supplies:** Managing heat in DC-DC converters.