The **ATS-17B-30-C2-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed for thermal management in electronic systems, primarily to dissipate heat from integrated circuits (ICs) and other electronic components. --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 70.00mm x 70.00mm x 25.00mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 5.31°C/W (at 100 LFM) | | **Fin Type** | Straight Fin | | **RoHS Status** | Compliant | --- ## 2. Key Electronic Features ### A. pushPIN™ Attachment System Unlike standard adhesive-backed heat sinks, this part uses the **pushPIN™** system. This involves: * **Compression Springs:** Provides precise pressure across the interface to optimize thermal transfer. * **Plastic/Brass Pins:** Securely locks the heat sink into pre-drilled holes on the Printed Circuit Board (PCB). ### B. Thermal Interface Material (TIM) The "R0" suffix typically denotes that the part comes with a pre-applied **Thermal Interface Material**. This is a conductive pad or grease that fills microscopic air gaps between the heat sink and the electronic component (CPU/GPU), significantly lowering thermal resistance. ### C. Thermal Performance The heat sink is engineered for **Active or Passive Airflow**. Its performance improves significantly as air velocity (measured in Linear Feet per Minute - LFM) increases: * **Low Airflow (100 LFM):** ~5.31°C/W * **High Airflow (500 LFM):** ~1.17°C/W --- ## 3. Applications This component is generally used in high-power electronic environments where failure due to overheating is a risk: 1. **Telecommunications:** Cooling high-speed processors in routers and switches. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Electronics:** Dissipating heat from MOSFETs or large power regulators. --- ## 4. Part Number Breakdown The nomenclature can be interpreted as follows: * **ATS:** Advanced Thermal Solutions (Manufacturer) * **17B:** Series/Body style * **30:** Specific fin configuration/height * **C2:** Material/Finish (Blue Anodized Aluminum) * **R0:** Packaging or TIM revision code