The part number **ATS-17B-32-C2-R0** refers to a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. This specific part is from their *maxiFLOW™* line, designed for cooling electronic components like CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Technical Specifications The component is characterized by its physical dimensions and thermal performance metrics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (with Blue Anodized Finish) | | **Dimensions (L x W x H)** | 57.00mm x 57.00mm x 15.00mm | | **Thermal Resistance** | 1.15°C/W (at 200 LFM) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Interface Material (TIM)** | T766 (High Performance) | --- ### 2. Design and Component Breakdown This part is not a single piece of metal but an assembly of several engineering elements: #### A. Fin Geometry (maxiFLOW™) The "B" in the part number indicates a **straight fin** design. The maxiFLOW™ geometry features a flared fin structure which maximizes surface area and increases the "scrubbing" effect of the airflow, significantly reducing thermal resistance compared to standard extruded heatsinks. #### B. Attachment System: pushPIN™ Unlike adhesive tapes that can fail under high heat, this part uses the **pushPIN™** system: * **Springs:** Provides consistent pressure (force) across the component to ensure optimal contact. * **Plastic/Brass Pins:** Secure the heatsink to pre-drilled holes in the PCB. #### C. Thermal Interface Material (TIM) The part comes pre-applied with **T766**. This is a phase-change or high-conductivity material that fills the microscopic air gaps between the chip surface and the heatsink base, ensuring maximum heat transfer. --- ### 3. Part Number Decoder (ATS-17B-32-C2-R0) | Segment | Meaning | | :--- | :--- | | **ATS-17** | Series Identifier (maxiFLOW Design) | | **B** | Straight Fin Pattern | | **32** | Specific Dimension Set (57x57x15mm) | | **C2** | Material/Finish (Blue Anodized Aluminum) | | **R0** | Revision/Standard Packaging code | --- ### 4. Application Use-Case This part is typically used in: * **Telecommunications:** Cooling high-speed switching ASICs. * **Embedded Systems:** Industrial PCs where space is constrained but heat output is high. * **Power Electronics:** Cooling MOSFET arrays or power modules.