The **ATS-17B-35-C2-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or damage. --- ### 1. Component Specifications The following table outlines the technical specifications based on the part number breakdown: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 35mm x 35mm x 10mm | | **Fin Style** | Straight (Fine Pitch) | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Part Number Breakdown The nomenclature used by ATS provides specific details about the physical build: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **17**: Represents the specific fin pattern and spacing design. * **B**: Revision or specific series designator. * **35**: The base size (35mm x 35mm). * **C2**: The height of the heat sink (10mm). * **R0**: Refers to the specific thermal performance and material/finish package. --- ### 3. Key Electronic Functions & Benefits * **Thermal Management:** The primary function is to increase the surface area of a heat-generating component, allowing air to carry away heat more efficiently. * **pushPIN™ Attachment:** Unlike adhesive tapes, the push-pin mechanism provides a secure, consistent pressure (preload) against the component. This ensures better contact with the Thermal Interface Material (TIM). * **Low Profile:** At only 10mm high, this part is ideal for "small form factor" electronics or 1U server racks where vertical space is limited. * **Blue Anodized Finish:** The anodized coating is not just for aesthetics; it provides moderate electrical insulation and increased corrosion resistance. --- ### 4. Thermal Performance Comparison Thermal resistance is measured in Celsius per Watt (°C/W). Lower values indicate better cooling. | Airflow Velocity (LFM) | Thermal Resistance (Unducted) | | :--- | :--- | | 100 (0.5 m/s) | ~12.83 °C/W | | 400 (2.0 m/s) | ~4.12 °C/W | | 700 (3.5 m/s) | ~2.96 °C/W |