The **ATS-17B-36-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to their high-performance **maxiFLOW™** heatsink family, designed specifically for cooling integrated circuits (ICs) like BGA (Ball Grid Array) packages. --- ## 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-17B-36-C2-R0 | | **Component Type** | Heat Sink | | **Material** | Aluminum (Black Anodized) | | **Mounting Type** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 36.83mm x 36.83mm | | **Height (Fin Height)** | 12.70mm | | **Thermal Resistance** | 14.82°C/W (at 1.0 m/s airflow) | | **Attachment Method** | Plastic push-pins and brass springs | --- ## 2. Key Features and Design The "ATS-17B" series utilizes a specialized fin pattern designed to maximize surface area and airflow efficiency. ### A. maxiFLOW™ Fin Geometry The fins are designed with a **flared profile**, which reduces pressure drop across the device. This allows for better thermal performance in constrained spaces where air intake might be limited. ### B. pushPIN™ Attachment Unlike adhesive tapes that can fail under high heat, this model uses a mechanical **pushPIN™** system: * **Secure Fit:** Ensures constant pressure between the heat sink and the processor. * **Easy Installation:** Features a pre-drilled hole pattern for quick assembly. * **Reliability:** The brass springs provide long-term tension to maintain high thermal conductivity. ### C. Thermal Interface Material (TIM) This specific part number typically comes with **T766** pre-applied thermal phase-change material. This ensures that the microscopic gaps between the chip and the aluminum are filled to prevent heat buildup. --- ## 3. Applications The ATS-17B-36-C2-R0 is commonly found in industrial and computing hardware: * **Network Switches/Routers:** Cooling high-speed processing chips. * **FPGA & BGA Packages:** General-purpose cooling for square-profile ICs. * **Power Supplies:** Heat dissipation for voltage regulators. ---