## Technical Overview: ATS-17B-40-C2-R0 The **ATS-17B-40-C2-R0** is a high-performance **heat sink** assembly designed by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, specifically engineered for cooling electronic components such as processors, FPGAs, and ASICs where space is constrained and airflow is critical. --- ### 1. Key Technical Specifications The following table summarizes the physical and thermal properties of this specific component: | Feature | Specification | | :--- | :--- | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | pushPIN™ | | **Thermal Resistance (Flowing)** | 1.21 °C/W @ 200 LFM | | **Thermal Resistance (Static)** | 2.70 °C/W (Unducted) | | **Dimensions (L x W)** | 48.26 mm x 48.26 mm | | **Height** | 17.78 mm | | **Interface Material** | T766 (Thermal Tape) | --- ### 2. Component Design & Functionality #### A. Fin Geometry This model features **fluted fin geometry**. Unlike standard square fins, these are tapered to maximize surface area while minimizing pressure drop. This allows for high-velocity airflow to move efficiently through the sink, effectively pulling heat away from the semiconductor die. #### B. pushPIN™ Attachment System The "R0" suffix refers to the attachment mechanism. It uses a specialized **pushPIN™** system which includes: * **Flexible Springs:** Ensure precise pressure (load) is applied to the component. * **Brass/Plastic Pins:** Secure the heat sink to pre-drilled holes in the PCB. * **Ease of Assembly:** Allows for repeatable installation without the risk of over-tightening or uneven thermal contact. #### C. Thermal Interface Material (TIM) The unit comes pre-applied with **T766 thermal phase-change material**. This eliminates the need for manual application of thermal paste and ensures a uniform, void-free contact between the electronic part and the aluminum base. --- ### 3. Application Use Cases This part is typically found in the following electronic environments: 1. **Telecommunications:** Cooling line cards and high-speed routers. 2. **Embedded Systems:** Industrial PCs where vertical clearance is limited (17.78mm height). 3. **Power Electronics:** Dissipating heat from high-current MOSFETs or voltage regulators. ---