ATS-17B-48-C2-R0
AI

The **ATS-17B-48-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It belongs to the **pushPIN™** series, designed for secure and efficient cooling of integrated circuits (ICs).
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### 1. Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) |
| **Series** | pushPIN™ |
| **Attachment Method** | Push Pin (Plastic or Brass) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Thermal Resistance** | 7.59 °C/W (Unducted Flow @ 100 LFM) |
| **Dimensions (L x W x H)** | 25mm x 25mm x 15mm |
| **Fin Pattern** | Straight Fin |
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### 2. Physical Design & Construction
* **Dimensions:** The base measures **25x25mm**, with a height of **15mm**. This compact footprint is ideal for small form-factor PCBs or densely packed electronic assemblies.
* **Material:** It is made of **Aluminum 6063**, which offers a balance between high thermal conductivity and lightweight properties.
* **Fin Style:** It utilizes a "Straight Fin" design. This is optimized for airflow traveling in a specific direction, maximizing the surface area for heat dissipation.
* **Finish:** The blue anodized coating protects the aluminum from corrosion and slightly improves radiant heat transfer.
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### 3. Attachment Mechanism: pushPIN™
This part uses the proprietary **pushPIN™** system, which replaces traditional adhesive tapes or clumsy wire clips.
* **Compression Spring:** It features a built-in spring that provides precise pressure (7-10 lbs) across the thermal interface material (TIM).
* **Secure Fit:** The push-pins snap into pre-drilled holes in the PCB, ensuring the heat sink stays mounted even during mechanical vibration or shipping.
* **Interchangeability:** The pins are available in different lengths and materials (plastic or brass) to suit various PCB thicknesses.
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### 4. Thermal Performance
The efficiency of the ATS-17B-48-C2-R0 depends on the airflow (measured in Linear Feet per Minute - LFM):
| Airflow Velocity | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 LFM (0.5 m/s) | 7.59 |
| 300 LFM (1.5 m/s) | 4.02 |
| 500 LFM (2.5 m/s) | 3.14 |
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### 5. Part Number Breakdown
The suffix **C2** generally indicates the **Thermal Interface Material (TIM)** provided with the unit (usually a high-performance T766 phase-change material), and **R0** refers to the revision or packaging standard.
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What are the recommended PCB hole sizes for the pushPIN attachment?
- ⤷ How does the 'C2' thermal interface material compare to standard thermal paste?
- ⤷ Are there alternative fin patterns available for this specific footprint?