## Overview of ATS-17B-49-C2-R0 The **ATS-17B-49-C2-R0** is a specific model of a **High-Performance Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to their *pushPIN™* series, designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits (ICs). --- ### Technical Specifications The following table outlines the physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Dimensions** | 25mm x 25mm x 20mm | | **Thermal Resistance** | 5.40 °C/W (at 1.0 m/s airflow) | | **Weight** | ~28 grams | | **Mounting Pattern** | 2-hole configuration | --- ### Electronic and Thermal Functionality While not an active electronic component (like a transistor or IC), the ATS-17B-49-C2-R0 is a critical **passive thermal management part**. Its primary functions include: #### 1. Heat Dissipation It utilizes a **cross-cut fin pattern** which increases surface area. This allows air to flow through the fins in multiple directions, maximizing the transfer of heat from the electronic component to the ambient air. #### 2. Thermal Interface Material (TIM) The "C2" in the part number indicates that the heat sink comes pre-applied with **T766 Phase Change Material**. This is a high-performance interface that fills microscopic air gaps between the heat sink base and the chip to improve thermal conductivity. #### 3. Secure Mounting (pushPIN™ System) The assembly uses a flexible, spring-loaded attachment mechanism. This ensures: * **Constant Pressure:** Maintains optimal contact between the heat sink and the chip. * **Vibration Resistance:** Prevents the heat sink from shifting during transport or operation. * **Ease of Installation:** Allows for quick assembly onto the PCB without complex tools. --- ### Component Composition 1. **Heat Sink Body:** Extruded aluminum designed for high thermal conductivity. 2. **Push Pins:** Made of nylon or brass, these lock into the PCB holes. 3. **Springs:** Stainless steel compression springs that provide the necessary downward force. 4. **Interface Pad:** The pre-applied T766 thermal foil/grease. ---