The **ATS-17B-55-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling electronic components like CPUs, GPUs, or power transistors. Produced by *Advanced Thermal Solutions (ATS)*, this part belongs to the **push-pin** attachment series, designed for secure PCB mounting. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Resistance** | 23.98°C/W (Natural Convection) | | **Dimensions (L x W x H)** | 35mm x 35mm x 10mm | | **Fin Type** | XCUT (Cross-Cut) | | **Thermal Interface Material (TIM)** | T766 (High Performance) | --- ### 2. Key Electronic Components Breakdown #### A. The XCUT Fin Design Unlike standard longitudinal fins, the **XCUT** design creates a grid of pin-like structures. In electronics, this is critical because it allows for **multi-directional airflow**. If the cooling fan in a chassis isn't perfectly aligned with the heatsink, the XCUT design still captures air from any angle. #### B. Push-Pin Mounting System This part uses a spring-loaded push-pin system. This is electronically significant for two reasons: 1. **Constant Pressure:** It ensures the heatsink maintains a consistent "clamp force" against the semiconductor, preventing air gaps. 2. **Shock/Vibration Resistance:** It prevents the heatsink from shifting during transport or operation, which protects the delicate solder joints of the BGA (Ball Grid Array) component underneath. #### C. Thermal Interface Material (T766) The "C2" in the part number indicates it comes pre-applied with **T766 phase-change material**. This material fills the microscopic air gaps between the heatsink and the electronic chip, significantly lowering the thermal impedance. --- ### 3. Typical Applications * **Networking Gear:** Switches and Routers. * **Embedded Computing:** Industrial PC processors. * **Power Supplies:** Cooling MOSFETs or Voltage Regulators. * **LED Systems:** High-output LED thermal management. --- ### 4. Part Number Decoder To understand variations of this part, use this reference: ```text ATS - 17 B - 55 - C2 - R0 | | | | | | | | | +-- Revision Code | | | +------- Thermal Interface Material (T766) | | +------------ Height (10mm) | +----------------- Fin Pitch/Style +----------------------- Advanced Thermal Solutions (Manufacturer) ```