The **ATS-17B-57-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance heat sink designed for cooling integrated circuits (ICs) and other electronic components. Below is a detailed breakdown of its specifications and electronic application. --- ### 1. General Specifications This part belongs to the **pushPIN™** Heat Sink Assembly series. It is designed to be mounted directly onto a Printed Circuit Board (PCB). | Property | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Thermal Resistance** | 13.16°C/W (Unducted Flow @ 100 LFM) | --- ### 2. Physical Dimensions Precision in dimensions is critical for ensuring the heat sink fits within the electronic enclosure and aligns with the chip surface. * **Size (L x W):** 40mm x 40mm * **Height:** 15mm * **Pitch (Fin Spacing):** Fine Pitch (High density of fins for maximum surface area) * **Hole Pattern:** 33mm x 33mm (Diagonal/Square spacing for the push pins) --- ### 3. Thermal Performance In electronics, managing the "Thermal Resistance" is vital to prevent component failure. The performance of the ATS-17B-57-C2-R0 varies based on the airflow (LFM - Linear Feet per Minute): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (0.5 m/s)** | 13.16 | | **200 (1.0 m/s)** | 4.61 | | **400 (2.0 m/s)** | 2.72 | | **600 (3.0 m/s)** | 2.02 | --- ### 4. Mounting Mechanism (Push-Pin) The "R0" in the part number indicates the specific revision and mounting hardware. * **Springs:** The assembly uses brass or steel springs to provide consistent pressure. * **Push-Pins:** Usually made of nylon or plastic, these snap into pre-drilled holes in the PCB. * **Thermal Interface Material (TIM):** This model typically comes with a pre-applied **T766** thermal phase-change material or tape to ensure a low-resistance thermal path between the chip and the aluminum. --- ### 5. Application Use Cases This component is typically found in: 1. **Telecommunications:** Cooling small processors in routers or switches. 2. **Embedded Systems:** Industrial PCs where space is limited. 3. **Power Electronics:** Cooling MOSFETs or voltage regulators.