The **ATS-17B-58-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). Below is a detailed breakdown of its technical specifications and electronic application characteristics. --- ### 1. Technical Specifications The part belongs to the **pushPIN™** series, designed for easy and secure attachment to Printed Circuit Boards (PCBs). | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 10.11 °C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 25.00mm | | **Fin Type** | Straight | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Design and Construction * **Fin Pattern:** It uses a "Straight Fin" design. This is optimized for uni-directional airflow, making it ideal for systems where a dedicated fan pushes air in a single linear path. * **Material Choice:** Aluminum 6063 is used for its excellent thermal conductivity-to-weight ratio. * **Surface Treatment:** The **Blue Anodized** finish isn't just aesthetic; it provides increased corrosion resistance and slightly improves radiative heat transfer. ### 3. Electronic Attachment System (pushPIN™) This specific part utilizes a specialized mounting system that replaces traditional adhesive tapes or clunky clips: * **Spring-Loaded Bolts:** Provides a precise and consistent pressure (load) on the electronic component (CPU/GPU/FPGA). * **Reliability:** The mechanical attachment ensures the heat sink does not shift during vibration or thermal cycling. * **Plastic/Brass Push Pins:** Used to lock the heat sink into pre-drilled holes in the PCB. --- ### 4. Thermal Performance Data Performance varies based on the airflow (velocity) within the electronic enclosure: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 10.11 | | 300 (1.5 m/s) | 3.48 | | 500 (2.5 m/s) | 2.09 | | 700 (3.5 m/s) | 1.61 | --- ### 5. Common Applications This heat sink is typically found in: * **Network Switches/Routers:** Cooling high-speed processing chips. * **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators. * **Embedded Systems:** Industrial PCs where high reliability is required.