The **ATS-17B-60-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It belongs to the **pushPIN™** series, designed for secure and efficient cooling of integrated circuits (ICs). --- ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. | | **Part Number** | ATS-17B-60-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 37.00mm x 37.00mm x 25.00mm | | **Thermal Resistance (Unducted)** | 6.36 °C/W @ 100 LFM | | **Thermal Interface Material (TIM)** | T766 (High Performance) | --- ### 2. Key Component Features #### A. Fin Design (Fine Pitch) The "B" in the part number indicates the fin pattern. This model typically utilizes a **cross-cut** or **straight fin** design optimized for high-density airflows, maximizing surface area for heat dissipation within a compact 37mm footprint. #### B. pushPIN™ Attachment Mechanism Unlike adhesive tapes or simple clips, this part uses a **pushPIN™** system: * **Springs:** Provides consistent pressure (Pre-assembled). * **Plastic/Brass Pins:** Secure the heat sink to the PCB through pre-drilled holes. * **Reliability:** This ensures the heat sink does not shift during vibration or shipping. #### C. Thermal Interface Material (T766) The part comes with a pre-applied **T766 thermal grease**. This is a high-performance phase-change material that fills microscopic air gaps between the heat sink base and the electronic component (CPU/GPU/FPGA), significantly reducing thermal resistance. --- ### 3. Thermal Performance Profile The cooling efficiency depends on the velocity of the air (Measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 6.36 | | 200 | 1.0 | 2.38 | | 300 | 1.5 | 1.90 | | 400 | 2.0 | 1.66 | --- ### 4. Application Use Cases This specific heat sink is commonly found in: * **Networking Equipment:** High-speed routers and switches. * **Industrial PCs:** Compact motherboards where vertical space (25mm) is available. * **Embedded Systems:** Cooling FPGAs or ASICs that generate moderate heat.