The **ATS-17B-62-C2-R0** is a specific electronic component categorized as a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components (like CPUs, FPGAs, or power transistors) to prevent thermal throttling or failure. --- ### 1. Technical Specifications The part number itself contains coded information about its physical and thermal characteristics: | Property | Value / Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Attachment Method** | Push-Pin (Plastic) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 40mm x 40mm | | **Height** | 15mm | | **Thermal Resistance** | 16.48°C/W (Unducted @ 100 LFM) | | **Fin Type** | Straight Fin | --- ### 2. Key Features and Parts #### A. The Heat Sink Body The main body is made of **Aluminum 6063**. This material is chosen for its excellent thermal conductivity and light weight. The "Straight Fin" design allows for efficient airflow across the surface area, facilitating heat transfer via convection. #### B. The pushPIN™ Attachment Unlike adhesive tapes or heavy screws, this model uses a **push-pin and spring mechanism**: * **The Pins:** Usually made of brass or plastic. * **The Springs:** Stainless steel compression springs that provide consistent pressure (7-10 lbs/sq inch) to ensure optimal contact between the heat sink and the component. #### C. Thermal Interface Material (TIM) The "R0" at the end of the part number indicates the specific thermal interface material. * **Pre-applied TIM:** This model typically comes with **T766** (a high-performance thermal grease) pre-applied to the base, ensuring there are no air gaps between the heat sink and the chip. --- ### 3. Thermal Performance Comparison Thermal resistance is measured in Celsius per Watt (°C/W). Lower values indicate better cooling performance. | Airflow Velocity (LFM) | 100 (0.5m/s) | 300 (1.5m/s) | 500 (2.5m/s) | | :--- | :--- | :--- | :--- | | **Unducted Flow** | 16.48°C/W | 6.45°C/W | 4.32°C/W | | **Ducted Flow** | 4.45°C/W | 3.13°C/W | 2.59°C/W | --- ### 4. Typical Applications * **Integrated Circuits (ICs):** Cooling microprocessors or chipsets. * **Power Supplies:** Managing heat in voltage regulators. * **Embedded Systems:** Use in compact industrial PCs where space is limited but high-pressure mounting is required for vibration resistance.