The part number **ATS-17B-63-C2-R0** refers to a high-performance **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push-pin" series designed for cooling electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Brass | | **Thermal Resistance** | 2.85°C/W @ 100 LFM | | **Dimensions (L x W x H)** | 40mm x 40mm x 20mm | | **Fin Style** | Straight Fin | --- ### 2. Part Number Breakdown The part number can be decoded to understand the specific configuration: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **17B**: Refers to the specific series/frame size. * **63**: Indicates the fin height and density configuration. * **C2**: Specifies the Thermal Interface Material (TIM). "C2" typically refers to **ATS-PPS-02**, a high-performance thermal pad pre-applied to the base. * **R0**: Refers to the revision code (standard RoHS compliant version). --- ### 3. Key Electronic Functions While a heat sink is a passive mechanical part, it is critical for electronic reliability: * **Thermal Management:** It increases the surface area of the heat-generating component, allowing for better heat dissipation into the surrounding air via convection. * **Performance Stability:** By keeping the junction temperature ($T_j$) of a semiconductor low, it prevents "thermal throttling" (where a chip slows down to protect itself from heat). * **Longevity:** Maintaining lower operating temperatures significantly extends the Mean Time Between Failures (MTBF) of electronic circuits. --- ### 4. Installation Design This specific model uses a **Push-Pin** mounting system. * **Requirement:** The PCB must have pre-drilled holes. * **Benefit:** The push-pin and spring mechanism provide a precise amount of "clip pressure" (load) to ensure the thermal interface material makes perfect contact with the chip, which is more reliable than adhesive tapes.