The **ATS-17B-65-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from high-power electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-17B-65-C2-R0 | | **Material** | Aluminum (with Blue Anodized Finish) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions (L x W x H)** | 45mm x 45mm x 24.5mm | | **Thermal Resistance** | 7.29°C/W (at 200 LFM) | | **Fin Style** | Straight Fin | --- ### 2. Breakdown of the Part Number The alphanumeric string provides specific details about the component's build: * **ATS-17B**: Refers to the specific series and mechanical design within the ATS product line. * **65**: Corresponds to the specific physical dimensions and fin configuration. * **C2**: Indicates the **Thermal Interface Material (TIM)**. In this case, it usually refers to **T766**, a high-performance thermal pad or grease pre-applied to the base. * **R0**: Refers to the version or revision of the product. --- ### 3. Key Electronic Functions #### A. Thermal Dissipation This part is passive, meaning it does not use electricity itself. Instead, it increases the surface area of a hot component (like a microprocessor), allowing the surrounding air to carry away excess heat more efficiently. #### B. pushPIN™ Attachment System Unlike adhesive-based heat sinks, the "B" and "R0" variants typically use a specialized **pushPIN™** system. This involves: 1. **Brass Pins:** Inserted into pre-drilled holes in the PCB. 2. **Compression Springs:** Ensure even pressure across the chip surface for optimal thermal contact. #### C. EMI Protection (Secondary) The aluminum construction can provide a minor level of electromagnetic shielding for the component it covers, though its primary purpose is strictly thermal. --- ### 4. Typical Applications * **Telecommunications:** Cooling network switches and routers. * **Industrial PC:** High-reliability computing in hot environments. * **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators.