The **ATS-17B-68-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Property | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Product Series** | pushPIN™ Heat Sink | | **Attachment Method** | Push-Pin (with springs) | | **Material** | Aluminum (Body), Blue Anodized (Finish) | | **Dimensions (L x W x H)** | 45mm x 45mm x 15mm | | **Thermal Resistance** | 15.31°C/W (at 100 LFM) to 1.60°C/W (at 700 LFM) | | **Interface Material** | T766 (Pre-applied Thermal Interface Material) | --- ### 2. Key Electronic Components & Features The "electronic" functionality of this part is passive, but its design is critical for the stability of active electronic circuits. #### A. The Fin Design (Cross-Cut) The ATS-17B-68-C2-R0 uses a **cross-cut fin pattern**. This allows for "omni-directional" airflow, meaning it can dissipate heat effectively regardless of which direction the fan or air current is blowing across the PCB. #### B. Attachment Mechanism (Push-Pin) Instead of adhesive or soldering, this part uses a **Push-Pin and Spring** system: * **Stability:** Provides consistent pressure on the processor. * **Reliability:** Ensures a tight bond with the Thermal Interface Material (TIM). * **Reusability:** Can be removed and re-installed during board repair. #### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied. This is a phase-change material that fills the microscopic air gaps between the heat sink and the electronic chip, ensuring maximum heat transfer. --- ### 3. Application Use Cases This specific model is typically used on Medium-to-Large Scale Integrated circuits (LSIs) including: 1. **Network Switches/Routers:** Cooling high-speed processing chips. 2. **Embedded Systems:** For industrial computers where space is restricted (15mm height). 3. **Power Electronics:** Dissipating heat from MOSFET arrays or voltage regulators. ---