The **ATS-17B-69-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed for high-efficiency cooling of semiconductor devices like CPUs, FPGAs, and GPUs. --- ### 1. Technical Specifications The following table summarizes the key physical and thermal properties of this specific part number: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 45mm x 40mm x 20mm | | **Thermal Resistance** | 3.94°C/W (at 200 LFM) | | **Attachment Method** | pushPIN™ | | **Spring Type** | Brass (Nickel Plated) | | **Interface Material** | T766 (Thermal Tape) | | **Flow Pattern** | Spread Fin (maxiFLOW™) | --- ### 2. Key Component Features #### A. maxiFLOW™ Design Unlike traditional straight-fin heat sinks, the ATS-17B-69-C2-R0 uses a **flared fin structure**. This design maximizes the surface area for radiant cooling and increases air turbulence, which significantly improves thermal performance in forced-air environments. #### B. pushPIN™ Attachment System This part uses a standardized mechanical attachment system: * **Ease of Use:** Allows for quick assembly to the PCB with a pre-drilled hole pattern. * **Reliability:** Uses a compression spring to ensure constant, even pressure across the component surface, which is critical for maximizing thermal transfer. #### C. Thermal Interface Material (TIM) The unit comes pre-applied with **T766** thermal tape. This eliminates the need for messy thermal grease during installation while providing a low thermal resistance path between the chip and the heat sink. --- ### 3. Applications This heat sink is typically found in: * **Telecommunications:** High-speed routers and switches. * **Computing:** Embedded systems and industrial PC motherboards. * **Power Electronics:** Voltage regulators and high-density power modules. ---