The **ATS-17B-80-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. Below is a detailed breakdown of its specifications and electronic application characteristics. --- ### 1. Technical Specifications The part number follows the standard Advanced Thermal Solutions (ATS) naming convention: | Feature | Specification | Details | | :--- | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | Specialist in thermal management | | **Material** | Aluminum | Lightweight with high thermal conductivity | | **Finish** | Blue Anodized | Increases surface emissivity and provides corrosion resistance | | **Attachment Method** | pushPIN™ | Spring-loaded pin mechanism for secure PCB mounting | | **Thermal Resistance** | 1.90° C/W (@ 1.0 m/s) | Measures heat dissipation efficiency | | **Dimensions** | 30mm x 30mm x 15mm | Compact footprint for dense PCB layouts | | **Weight** | ~30 grams | Standard for mid-range cooling solutions | --- ### 2. Functional Components The ATS-17B-80-C2-R0 is engineered with specific electronic cooling features: * **Finned Design (Cross-Cut):** The "80" series typically features a high-density fin pattern. The cross-cut design allows for multidirectional airflow, making it effective in systems where air direction is not strictly linear. * **Push-Pin Mounting:** Unlike adhesive-backed heatsinks, this part uses a mechanical push-pin system. This ensures a consistent downward force (pressure) on the electronic chip, which optimizes the thermal interface material (TIM) performance. * **C2 Material Grade:** This indicates the use of high-quality aluminum alloy optimized for thermal transfer rather than structural strength alone. --- ### 3. Application in Electronics This part is commonly used to protect sensitive electronic components from **thermal throttling** or **permanent damage**. 1. **Processor Cooling:** Used for FPGAs, ASICs, and small CPUs in networking equipment. 2. **Power Electronics:** Applied to MOSFET arrays or high-speed voltage regulators that generate localized heat. 3. **Industrial Controls:** Used in environments where reliability is critical and mechanical fastening is preferred over adhesives (which can dry out and fail over time). --- ### 4. Thermal Performance Data Performance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | | 0.5 (Natural Convection) | 3.50 | | 1.0 (Low Flow) | 1.90 | | 2.5 (High Flow) | 1.30 |