The **ATS-17B-84-C2-R0** is a specific high-performance electronic thermal management component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to their "pushPIN™" heat sink line, designed for cooling integrated circuits (ICs) and other electronic components. --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (LxWxH)** | 30.00 mm x 30.00 mm x 35.00 mm | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Spring Material** | Brass | | **Thermal Interface Material (TIM)** | T766 (Pre-applied phase change material) | | **Number of Fins** | Fine pitch (High density) | --- ## 2. Component Features ### A. pushPIN™ Attachment System Unlike adhesive-based heat sinks, this part uses a mechanical attachment system. This ensures: * **Constant Pressure:** The spring-loaded mechanism applies uniform pressure across the component surface, maximizing heat transfer. * **Reliability:** It is resistant to shocks and vibrations that might cause adhesive tapes to fail. * **Ease of Installation:** It uses pre-drilled holes in the PCB for secure mounting. ### B. Thermal Performance The "84" series indicates a specific fin geometry designed for optimal airflow. * **Cross-Cut Design:** The fins are often designed in a cross-cut or "pin fin" pattern to allow airflow from any direction (omnidirectional). * **Height:** At 35mm, it is a relatively tall heat sink, providing a large surface area for heat dissipation in systems with vertical clearance. ### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied. This is a high-performance thermal pad that softens at operating temperatures to fill microscopic air gaps between the heat sink and the chip, significantly lowering thermal resistance. --- ## 3. Naming Convention Breakdown The part number follows a specific logic: 1. **ATS:** Advanced Thermal Solutions (Manufacturer). 2. **17:** Indicates the series/type of heat sink. 3. **B:** Specific revision or material grade. 4. **84:** Indicates the specific fin pattern and height configuration. 5. **C2:** Refers to the thermal performance kit (usually includes the specific spring and plastic/brass pin type). 6. **R0:** Standard RoHS compliant packaging/versioning. --- ## 4. Typical Applications This component is generally used for: * **Processors (CPUs/GPUs):** Small form factor processing units. * **FPGAs:** Field Programmable Gate Arrays that generate significant heat. * **Telecommunications:** Network switches and routers where airflow is managed but thermal density is high.